Superspeed USB 3.0, a next gen Interconnect
Popular USB Computer Connection Technology Expands performance with Proposed USB 3.0 Specification.
Intel and other industry leaders have formed the USB 3.0 Promoter Group to create a superspeed personal USB interconnect that can deliver over 10 times the speed of today's connection. The technology, also developed by HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated, will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes.
USB (Universal Serial Bus) 3.0 will create a backward-compatible standard with the same ease-of-use and plug N play capabilities of previous USB technologies. Targeting over 10x performance increase, the technology will draw from the same architecture of wired USB. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency.
USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities. "USB 3.0 is the next logical step for the PC's most popular wired connectivity," said Jeff Ravencraft, technology strategist with Intel and president of the USB Implementers Forum (USB-IF). Intel formed the USB 3.0 Promoter Group with the understanding that the USB-IF would act as the trade association for the USB 3.0 specification. A completed USB 3.0 specification is expected by the first half of 2008. USB 3.0 implementations will initially be in the form of discrete silicon. The USB 3.0 Promoter Group is committed to preserving the existing USB device class driver infrastructure and investment, look-and-feel and ease-of-use of USB while continuing to expand this great technology's capabilities.
About the USB-IF:
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality compatible USB devices, through its logo and compliance program and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF Web site at www.usb.org.
USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities. "USB 3.0 is the next logical step for the PC's most popular wired connectivity," said Jeff Ravencraft, technology strategist with Intel and president of the USB Implementers Forum (USB-IF). Intel formed the USB 3.0 Promoter Group with the understanding that the USB-IF would act as the trade association for the USB 3.0 specification. A completed USB 3.0 specification is expected by the first half of 2008. USB 3.0 implementations will initially be in the form of discrete silicon. The USB 3.0 Promoter Group is committed to preserving the existing USB device class driver infrastructure and investment, look-and-feel and ease-of-use of USB while continuing to expand this great technology's capabilities.
About the USB-IF:
The non-profit USB Implementers Forum, Inc. was formed to provide a support organization and forum for the advancement and adoption of USB technology. The USB-IF facilitates the development of high-quality compatible USB devices, through its logo and compliance program and promotes the benefits of USB and the quality of products that have passed compliance testing. Further information, including postings of the most recent product and technology announcements, is available by visiting the USB-IF Web site at www.usb.org.
source: Intel press release
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